Datasheet

AD8556
Rev. A | Page 26 of 28
OUTLINE DIMENSIONS
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
× 45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
41
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2440)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012-AA
Figure 56. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)
Dimensions shown in millimeters and (inches)
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.50
0.40
0.30
0.25 MIN
2.50
2.35 SQ
2.20
010606-0
Figure 57. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-16-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD8556ARZ
1
−40°C to +140°C 8-Lead SOIC_N R-8
AD8556ARZ-REEL
1
−40°C to +140°C 8-Lead SOIC_N R-8
AD8556ARZ-REEL7
1
−40°C to +140°C 8-Lead SOIC_N R-8
AD8556ACPZ-R2
1
−40°C to +140°C 16-Lead LFCSP_VQ CP-16-10
AD8556ACPZ-REEL
1
−40°C to +140°C 16-Lead LFCSP_VQ CP-16-10
AD8556ACPZ-REEL7
1
−40°C to +140°C 16-Lead LFCSP_VQ CP-16-10
1
Z = RoHS Compliant Part.