Manualshelf

Datasheet

ManualsBrandsANALOG DEVICES ManualsLinear ICsLinear IC - Op-amp Multi-purpose SOIC 8
11121314151617181920
AD8531/AD8532/AD8534
Rev. F | Page 18 of 20
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
8°
0°
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 50. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
8
5
41
PIN 1
0.65 BSC
SEATING
PLANE
0.15
0.05
0.30
0.19
1.20
MAX
0.20
0.09
8°
0°
6.40 BSC
4.50
4.40
4.30
3.10
3.00
2.90
COPLANARITY
0.10
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AA
Figure 51. 8-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-8)
Dimensions shown in millimeters
4.50
4.40
4.30
14
8
71
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65
BSC
SEATING
PLANE
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
8°
0°
0.75
0.60
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
Figure 52. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
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