Datasheet

AD8509/AD8511
Rev. C | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
Parameter Rating
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Supply Voltage 7 V
Input Voltage GND to V
S
Table 3. Thermal Resistance
Storage Temperature Range
Package Type θ
JA
θ
JC
Unit
TSSOP (RV-48)
−65°C to +150°C
48-Lead, Pb-Free SSOP (RV-48) 115 42 °C/W
Operating Temperature Range
−40°C to +85°C
48-Lead, Pb-Free LFCSP (CP-48-1) 125 29 °C/W
Junction Temperature Range
TSSOP (RV-48) Package
−65°C to +150°C
Lead Temperature Range
Table 4. MUX Function
(Soldering, 60 sec) 300°C
A/B Select Input
Logic High INAx
Logic Low INBx
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.