Datasheet

AD8505/AD8506/AD8508
Rev. E | Page 19 of 20
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 55. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
061208-A
A
B
C
D
E
0.650
0.595
0.540
1.50
1.46
1.42
3.00
2.96
2.92
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.340
0.320
0.300
2.00
BSC
BALL 1
IDENTIFIER
SEATING
PLANE
1.00
BSC
0.50
BSC
0.50 BSC
0.25
BSC
0.25
BSC
0.25
BSC
0.25
BSC
0.50 BSC
0.50 BSC
0.380
0.355
0.330
0.270
0.240
0.210
0.10 MAX
COPLANARITY
Figure 56. 14-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-14-1)
Dimensions shown in millimeters