Datasheet

AD8502/AD8504
Rev. A | Page 14 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-178-BA
121608-A
8°
4°
0°
SEATING
PLANE
1.95
BSC
0.65 BSC
0.60
BSC
76
1234
5
3.00
2.90
2.80
3.00
2.80
2.60
1.70
1.60
1.50
1.30
1.15
0.90
0
.15 MAX
0
.05 MIN
1.45 MAX
0.95 MIN
0.22 MAX
0.08 MIN
0.38 MAX
0.22 MIN
0.60
0.45
0.30
PIN 1
INDICATOR
8
Figure 40. 8-Lead Small Outline Transistor Package [SOT-23]
(RJ-8)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 41. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
AD8502ARJZ-R2
1
−40°C to +125°C 8-Lead SOT-23 RJ-8 A1D
AD8502ARJZ-REEL
1
−40°C to +125°C 8-Lead SOT-23 RJ-8 A1D
AD8502ARJZ-REEL7
1
−40°C to +125°C 8-Lead SOT-23 RJ-8 A1D
AD8504ARUZ
1
−40°C to +125°C 14-Lead TSSOP RU-14
AD8504ARUZ-REEL
1
−40°C to +125°C 14-Lead TSSOP RU-14
1
Z = RoHS Compliant Part.