Datasheet

Data Sheet AD8476
Rev. B | Page 21 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-AA
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
10-07-2009-B
Figure 57. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
3.10
3.00 SQ
2.90
0.27
0
.20
0
.15
1.75
1.60 SQ
1.45
01-28-2010-B
1
0.50
BS
C
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
0.50
0
.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
FOR PROPER CONNECTIO
N OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
F
UNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
COMPLIANT
TO
JEDEC STANDARDS M
O-229-WEEE.
Figure 58. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-25)
Dimensions shown in millimeters