Datasheet

AD8465 Data Sheet
Rev. A | Page 14 of 16
OUTLINE DIMENSIONS
*
1.65
1.50 SQ
1.35
*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
010809-B
1
0.50
BSC
0.50
0.40
0.30
0.25 MIN
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
12
4
10
6
7
9
3
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM
VIEW)
SEATING
PLANE
3.15
3.00 SQ
2.85
2.95
2.75 SQ
2.55
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 26. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-12-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
AD8465WBCPZ-WP −40°C to +125°C 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-12-3 Y24
AD8465WBCPZ-R7 −40°C to +125°C 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-12-3 Y24
1
Z = RoHS Compliant Part.