Datasheet

Data Sheet AD8432
Rev. C | Page 29 of 32
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
04-12-2012-A
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.65
2.50 SQ
2.45
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.05 MAX
0.02 NOM
Figure 81. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm, Very Very Thin Quad
(CP-24-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8432ACPZ-R7 −40°C to +85°C 24-Lead LFCSP_WQ, 7” Tape and Reel CP-24-7
AD8432ACPZ-RL −40°C to +85°C 24-Lead LFCSP_WQ, 13” Tape and Reel CP-24-7
AD8432ACPZ-WP −40°C to +85°C 24-Lead LFCSP_WQ, Waffle Pack CP-24-7
AD8432-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.