Datasheet

AD842
–3–REV. E
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V
Internal Power Dissipation
2
Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Cerdip (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 W
TO-8 (H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
SOIC (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
LCC (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±6 V
Storage Temperature Range
Q, H, E . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
N, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Maximum internal power dissipation is specified so that T
J
does not exceed
+150°C at an ambient temperature of +25°C.
Thermal Characteristics:
θ
JC
θ
JA
θ
SA
Plastic Package 30°C/W 100°C/W
Cerdip Package 30°C/W 110°C/W 38°C/W
TO-8 Package 30°C/W 100°C/W 27°C/W
16-Lead SOIC Package 30°C/W 100°C/W
20-Lead LCC Package 35°C/W 150°C/W
Recommended Heat Sink: Aavid Engineering© #602B
METALIZATION PHOTOGRAPH
Contact factory for latest dimensions.
Dimensions shown in inches and (mm).