Datasheet

AD8392A
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage ±13 V (+26 V)
Power Dissipation See Figure 3
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, θ
JA
is specified
for the device soldered in the circuit board for surface-mount
packages.
Table 3.
Package Type θ
JA
Unit
LFCSP-32 (CP) 27.27 °C/W
TSSOP-28/EP (RE) 35.33 °C/W
Maximum Power Dissipation
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). Assuming that the load (R
L
) is midsupply,
the total drive power is V
S
/2 × I
OUT
, some of which is dissipated
in the package and some in the load (V
OUT
× I
OUT
).
RMS output voltages should be considered. If R
L
is referenced
to V
S−
as in single-supply operation, the total power is V
S
× I
OUT
.
In single supply with R
L
to V
S−
, worst case is V
OUT
= V
S
/2.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the LFCSP-32 and
TSSOP-28/EP packages on a JEDEC standard 4-layer board.
θ
JA
values are approximations.
0
1
2
3
4
5
6
7
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
T
J
= 150°C
LFCSP-32
TSSOP-28/EP
0
6477-003
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
See the Thermal Considerations section for additional thermal
design guidance.
ESD CAUTION