Datasheet

AD8392A
Rev. 0 | Page 11 of 12
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AET
050806-A
28
15
14
1
EXPOSED
PAD
(Pins Up)
9.80
9.70
9.60
4.50
4.40
4.30
6.40
BSC
TOP VIEW
BOTTOM VIEW
0.65 BSC
0.15
0.05
COPLANARITY
0.10
1.20 MAX
1.05
1.00
0.80
0.30
0.19
SEATING
PLANE
0.20
0.09
3.05
3.00
2.95
8°
0°
0.75
0.60
0.45
3.55
3.50
3.45
Figure 21. 28-Lead Thin Shrink Small Outline with Exposed Pad [TSSOP/EP]
(RE-28-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
Figure 22. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad (CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD8392AAREZ
1
−40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP/EP) RE-28-1
AD8392AAREZ-RL
1
−40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP/EP) RE-28-1
AD8392AAREZ-R7
1
−40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP/EP) RE-28-1
AD8392AACPZ-R2
1
−40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8392AACPZ-RL
1
−40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8392AACPZ-R7
1
−40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
1
Z = Pb-free part.