Datasheet

AD8375 Data Sheet
Rev. A | Page 22 of 24
OUTLINE DIMENSIONS
COMPLIANT TO
JEDEC STANDARDS MO-220-VGGD-2
04-09-2012-A
1
0.50
BSC
PIN 1
INDIC
A
TOR
2.50 REF
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
2.25
2.10 SQ
1.95
24
7
19
12
13
18
6
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
Figure 51. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8375ACPZ-WP −40°C to +85°C 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Waffle Pack CP-24-1
AD8375ACPZ-R7 −40°C to +85°C 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7” Tape and Reel CP-24-1
AD8375-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.