Datasheet

AD8368
Rev. B | Page 19 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8
1
24
6
7
13
19
18
12
2.65
2.50 SQ
2.35
0.60 MAX
0.50
0.40
0.30
0.30
0.23
0.18
2.50 REF
0.50
BSC
12° MAX
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
1.00
0.85
0.80
SEATING
PLANE
PIN 1
INDICATOR
TOP
VIEW
3.75
BSC SQ
4.00
BSC SQ
PIN 1
INDICATOR
0.60 MAX
COPLANARITY
0.08
0.20 REF
0.23 MIN
EXPOSED
PA D
(BOTTOMVIEW)
082908-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 45. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-24-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
Ordering
Quantity
AD8368ACPZ-REEL7
1
−40°C to +85°C 24-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-24-3 1,500
AD8368ACPZ-WP
1, 2
−40°C to +85°C 24-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-24-3 64
AD8368-EVALZ
1
Evaluation Board
1
Z = RoHS Compliant Part.
2
WP = waffle pack.