Datasheet

AD8366
Rev. A | Page 28 of 28
OUTLINE DIMENSIONS
032807-A
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
2.85
2.70 SQ
2.55
TOP
VIEW
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.20 MIN
EXPOSED
PAD
(BOTTOM VIEW)
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 63. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8366ACPZ-R7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-8
AD8366-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
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D07584-0-3/11(A)