Datasheet

AD8352
Rev. B | Page 19 of 20
OUTLINE DIMENSIONS
1
0.50
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATO
R
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
(BOTTOM VIEW)
*
COMPLIANT
TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 41. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description
Ordering
Quantity
Package
Option
Branding
AD8352ACPZ-WP
1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ],
Waffle Pack
50 CP-16-3 Q0R
AD8352ACPZ-R7
1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ],
7” Tape and Reel
3000 CP-16-3 Q0R
AD8352ACPZ-R2
1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ],
7” Tape and Reel
250 CP-16-3 Q0R
AD8352-EVALZ
1
Evaluation Board
1
Z = RoHS Compliant Part.