Datasheet

AD8337
Rev. C | Page 29 of 32
OUTLINE DIMENSIONS
072408-B
1
EXPOSED
PA D
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 94. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
AD8337BCPZ-R2
1
−40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] CP-8-2 HVB
AD8337BCPZ-REEL
1
−40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] CP-8-2 HVB
AD8337BCPZ-REEL7
1
−40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] CP-8-2 HVB
AD8337BCPZ-WP
1
−40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] CP-8-2 HVB
AD8337-EVALZ
1
Evaluation Board with Noninverting Gain Configuration
AD8337-EVALZ-INV
1
Evaluation Board with Inverting Gain Configuration
AD8337-EVALZ-SS
1
Evaluation Board with Single-Supply Operation
1
Z = RoHS Compliant Part.