Datasheet

AD8337-EVAL
Rev. 0 | Page 5 of 8
POWER SUPPLY
TOP: SIGNAL GENERATO
R
10.05MHz, 500mV p-p
SIGNAL INPUT
–5V +5V
POWER
SPLITTER
PREAMP OUTPUT
VGAIN
POWER AMPLIFIERS
SPECTRUM ANALYZER
BOTTOM: SIGNAL GENERATOR
9.95MHz, 500mV p-p
05935-008
Figure 8. Typical Board Test Connections (One Channel Shown)
MEASUREMENT SETUP
As an example, Figure 8 shows board connections for two
generators. In this instance, the experiment illustrates IMD
measurements using standard off-the-shelf test equipment that
is used by Analog Devices, Inc. Of course, any equivalent
equipment can also be used.
BOARD LAYOUT CONSIDERATIONS
The AD8337 evaluation board is designed using four layers.
Interconnecting circuitry is located on the component and
wiring sides, with the inner layers dedicated to power and
ground planes.
Figure 9 through Figure 13 show the copper
layouts.
For ease of assembly, all board components are located on the
primary side and all are 0603 size surface mounts. Higher
density applications can require components on both sides of
the board and present no problem to the
AD8337, as
demonstrated in unreleased versions of the board that featured
secondary-side components and vias. Not evident in the figures
are thermal vias within the pad that solder to the mating pad of
the AD8337 chip-scale package. These vias serve as a thermal
path and are the primary means of removing heat from the
device. The thermal specifications in the
AD8337 data sheet are
predicated on the use of multilayer board construction with
these thermal vias to enable heat conductivity from the die.