Datasheet

AD8336
Rev. C | Page 26 of 28
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
OUTLINE DIMENSIONS
2
.
2
5
2
.
1
0
S
Q
1
.
9
5
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
(BOTTOM VIEW)
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.25 MIN
072808-A
0.75
0.60
0.50
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 89. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8336ACPZ-R7 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
AD8336ACPZ-RL −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
AD8336ACPZ-WP −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4
AD8336-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.