Datasheet
AD8331/AD8332/AD8334
Rev. G | Page 55 of 56
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8331ARQ –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQ-REEL –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQ-REEL7 –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQZ –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQZ-RL –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQZ-R7 –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331-EVALZ Evaluation Board with AD8331ARQ
AD8332ACP-R2 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACP-REEL –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACP-REEL7 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACPZ-R2 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACPZ-R7 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACPZ-RL –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ARU –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARU-REEL –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARU-REEL7 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARUZ –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARUZ-R7 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARUZ-RL –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332-EVALZ Evaluation Board with AD8332ARU
AD8334ACPZ –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1
AD8334ACPZ-REEL –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1
AD8334ACPZ-REEL7 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1
AD8334-EVALZ Evaluation Board with AD8334ACP
1
Z = RoHS Compliant Part.