Datasheet
Data Sheet AD8330
Rev. F | Page 31 of 32
OUTLINE DIMENSIONS
*
COMPLIANT
TO
JEDEC STANDAR
D
S M
O-
2
20
-V
E
ED
-
2
EXC
EPT
FOR E
XPO
SED
PAD
DIME
NSI
ON.
1
0.
50
BS
C
0
.
60
M
AX
P
IN
1
I
N
DIC
A
T
O
R
1.50 REF
0
.5
0
0.
4
0
0.30
0.25 MIN
0.
4
5
2.75
B
SC
SQ
TOP
V
IE
W
12° M
A
X
0.
8
0 M
AX
0.65 TYP
S
E
AT
I
NG
PL
A
NE
P
IN
1
IN
D
ICATOR
0
.
90
0
.8
5
0
.8
0
0.
3
0
0.
2
3
0
.1
8
0.05 M
AX
0.02 NOM
0
.2
0
REF
3.00
BS
C S
Q
*
1.
65
1.50 SQ
1.35
16
5
13
8
9
1
2
4
E
X
PO
SE
D
PAD
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN
CO
N
FI
GU
RATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
07-17-2008-A
Figure 78. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad, (CP-16-3)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-137-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
9
8
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
8°
0°
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
01-28-2008-A
Figure 79. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches and (millimeters)
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
AD8330ACPZ-R2 −40°C to +85°C 16-Lead LFCSP_VQ CP-16-3 JFZ
AD8330ACPZ-RL −40°C to +85°C 16-Lead LFCSP_VQ CP-16-3 JFZ
AD8330ACPZ-R7 −40°C to +85°C 16-Lead LFCSP_VQ CP-16-3 JFZ
AD8330ARQZ −40°C to +85°C 16-Lead QSOP RQ-16
AD8330ARQZ-RL −40°C to +85°C 16-Lead QSOP RQ-16
AD8330ARQZ-R7 −40°C to +85°C 16-Lead QSOP RQ-16
AD8330-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.