Datasheet

AD8317
Rev. B | Page 18 of 20
DIE INFORMATION
05541-039
BOND PAD STATISTICS
ALL MEASURMENTS IN MICRONS.
MINIMUM PASSIVATION OPENING: 59 × 59 MIN PAD PITCH: 89
DIE SIZE CALCULATION
ALL MEASURMENTS IN MICRONS.
DIEX (WIDTH OF DIE IN X DIRECTION) = 670
DIEY (WIDTH OF DIE IN Y DIRECTION) = 1325
DIE THICKNESS = 305 MICRONS
BALL BOND SHEAR STRENGTH SPECIFICATION: MINIMUM 15 GRAMS
1
2
2
3
4
5
6
7
8
Y
X
DB1
ADI AD8317
Figure 39. Die Outline Dimensions
Table 6. Die Pad Function Descriptions
Pin No. Mnemonic Description
1 INHI RF Input. Nominal input range of −50 dBm to 0 dBm, re: 50 Ω; ac-coupled RF input.
2, 2 COMM Device Common. Connect both pads to a low impedance ground plane.
3 CLPF
Loop Filter Capacitor. In measurement mode, this capacitor sets the pulse response time and video
bandwidth. In controller mode, the capacitance on this node sets the response time of the error
amplifier/integrator.
4 VSET Setpoint Control Input for Controller Mode or Feedback Input for Measurement Mode.
5 VOUT
Measurement and Controller Output. In measurement mode, VOUT provides a decreasing linear-in dB
representation of the RF input signal amplitude. In controller mode, VOUT is used to control the gain of
a VGA or VVA with a positive gain sense (increasing voltage increases gain).
6 TADJ
Temperature Compensation Adjustment. Frequency-dependent temperature compensation is set by
connecting a ground-referenced resistor to this pin.
7 VPOS Positive Supply Voltage: 3.0 V to 5.5 V.
8 INLO RF Common for INHI. AC-coupled RF common.
DB1 COMM Device Common. Connect to a low impedance ground plane.