Datasheet

AD8310
Rev. F | Page 22 of 24
DIE INFORMATION
3
2
18
7
6
5B
5A
4
X
Y
BOND PAD STATISTICS
ALL MEASUREMENTS IN MICRONS
MINIMUM PASSIVATION OPENING: 92 × 92, MINIMUM PAD PITCH: 150
DIE SIZE CALCULATION
ALL MEASUREMENTS IN MICRONS
DIE X (WIDTH OF DIE IN X DIRECTION) = 745
DIE Y (WIDTH OF DIE IN Y DIRECTION) = 1390
DIE THICKNESS = 305
COORDINATES OF BOND PAD CENTERS:
(1) –233, +540 (2) –250, +310 (3) –250, –273
(4) –250, –519 (5B) +250, –366 (5A) +250, –516
(6) +250, –218 (7) +249, +310 (8) +233, +540
01084-044
Figure 43. Die Outline Dimensions
Table 7. Die Pad Function Descriptions
Pin No. Mnemonic Description
1 INLO One of Two Balanced Inputs. Biased roughly to VPOS/2.
2 COMM Common Pin. Usually grounded.
3 OFLT Offset Filter Access. Nominally at about 1.75 V.
4 VOUT Low Impedance Output Voltage. Carries a 25 mA maximum load.
5A, 5B VPOS Positive Supply. 2.7 V to 5.5 V at 8 mA quiescent current.
6 BFIN Buffer Input. Used to lower postdetection bandwidth.
7 ENBL CMOS Compatible Chip Enable. Active when high.
8 INHI Second of Two Balanced Inputs. Biased roughly to VPOS/2.