Datasheet

AD8290
Rev. B | Page 20 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-248-UEED.
053106-B
1
0.50
BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
TOP VIEW BOTTOM VIEW
SEATING
PLANE
INDEX
AREA
0.60
0.55
0.51
0.30
0.25
0.18
0.05 MAX
0.02 NOM
0.40 MAX
0.30 NOM
0.08 REF
3.00
BSC SQ
1.80
1.70 SQ
1.55
16
5
13
8
9
12
4
EXPOSED
PAD
Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP_UQ]
3 mm × 3 mm Body, Ultra Thin Quad
(CP-16-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
AD8290ACPZ-R2
1
−40°C to +85°C 16-Lead LFCSP_UQ CP-16-12 Y0J
AD8290ACPZ-R7
1
−40°C to +85°C 16-Lead LFCSP_UQ CP-16-12 Y0J
AD8290ACPZ-RL
1
−40°C to +85°C 16-Lead LFCSP_UQ CP-16-12 Y0J
1
Z = RoHS Compliant Part.
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registered trademarks are the property of their respective owners.
D06745-0-2/08(B)