Datasheet

AD8280
Rev. C | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VTOP to VBOTx −0.3 V to +33 V
VIN0 to VBOTx −0.3 V to LDO + 0.3 V
VIN1 Through VIN6 Voltage to VBOTx −0.3 V to VTOP + 0.3 V
VTx to VBOTx −0.3 V to LDO + 0.3 V
TESTI, ENBI to GNDx −0.3 V to LDO + 0.3 V
DGTx, SELx, NPTC to GNDx −0.3 V to LDO + 0.3 V
AVOUTxx to GNDx −0.3 V to LDO + 0.3 V
TOP, BOT to VBOTx −0.3 V to VTOP + 0.3 V
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
48-Lead LQFP (ST-48) 54 15 °C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.