Datasheet

Data Sheet AD8276/AD8277
Rev. C | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Supply Voltage ±18 V
Maximum Voltage at Any Input Pin −V
S
+ 40 V
Minimum Voltage at Any Input Pin +V
S
− 40 V
Storage Temperature Range −65°C to +150°C
Specified Temperature Range −40°C to +85°C
Package Glass Transition Temperature (T
G
) 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The θ
JA
values in Table 5 assume a 4-layer JEDEC standard
board with zero airflow.
Table 5.
Package Type θ
JA
Unit
8-Lead MSOP 135 °C/W
8-Lead SOIC 121 °C/W
14-Lead SOIC 105 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8276/AD8277
is limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the properties of the plastic change. Even temporarily
exceeding this temperature limit may change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a temperature of 150°C
for an extended period may result in a loss of functionality.
2.0
1.6
1.2
0.8
0.4
0
–50 0–25 25 50 75 100 125
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMERATURE (°C)
T
J
MAX = 150°C
8-LEAD MSOP
θ
JA
= 135°C/W
8-LEAD SOIC
θ
JA
= 121°C/W
07692-002
14-LEAD SOIC
θ
JA
= 105°C/W
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
SHORT-CIRCUIT CURRENT
The AD8276/AD8277 have built-in, short-circuit protection
that limits the output current (see Figure 25 for more information).
While the short-circuit condition itself does not damage the
part, the heat generated by the condition can cause the part to
exceed its maximum junction temperature, with corresponding
negative effects on reliability. Figure 3 and Figure 25, combined
with knowledge of the supply voltages and ambient temperature of
the part, can be used to determine whether a short circuit will
cause the part to exceed its maximum junction temperature.
ESD CAUTION