Datasheet

AD8270
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Supply Voltage ±18 V
Output Short-Circuit Current
See derating
curve in
Figure 2
Input Voltage Range ±V
S
Storage Temperature Range −65°C to +130°C
Specified Temperature Range −40°C to +85°C
Package Glass Transition Temperature (T
G
) 130°C
ESD (Human Body Model) 1 kV
ESD (Charge Device Model) 1 kV
ESD (Machine Model) 0.1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 5. Thermal Resistance
Thermal Pad θ
JA
Unit
16-Lead LFCSP with Thermal Pad
Soldered to Board
57 °C/W
16-Lead LFCSP with Thermal Pad
Not Soldered to Board
96 °C/W
The θ
JA
values in Table 5 assume a 4-layer JEDEC standard
board with zero airflow. If the thermal pad is soldered to the
board, it is also assumed it is connected to a plane. θ
JC
at the
exposed pad is 9.7°C/W.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8270 is limited
by the associated rise in junction temperature (T
J
) on the die. At
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period of time can result in a loss of functionality.
The AD8270 has built-in, short-circuit protection that limits the
output current to approximately 100 mA (see
Figure 19 for
more information). While the short-circuit condition itself does
not damage the part, the heat generated by the condition can
cause the part to exceed its maximum junction temperature,
with corresponding negative effects on reliability.
06979-003
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
–50 –25 0 25 50 75 100 125
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
PAD SOLDERED
θ
JA
= 57°C/W
PAD NOT SOLDERED
θ
JA
= 96°C/W
T
J
MAXIMUM = 130°C
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION