Datasheet

AD8260
Rev. A | Page 32 of 32
OUTLINE DIMENSIONS
032807-A
COMPLIANT TO JE
DEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
2.85
2.70 SQ
2.55
TOP
VIEW
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.20 MIN
EXPOSED
PAD
(BOTTOM VIEW)
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 77. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Package Description Package Option
AD8260ACPZ-R7 −40°C to +105°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-8
AD8260ACPZ-RL −40°C to +105°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-8
AD8260ACPZ-WP −40°C to +105°C 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-8
AD8260-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
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D07192-0-2/11(A)