Datasheet

AD8235
Rev. 0 | Page 20 of 20
060409-A
OUTLINE DIMENSIONS
A
B
C
D
0.657
0.602
0.546
1.61
1.57
1.53
2.08
2.04
2.00
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.330
0.310
0.290
1.50
REF
SEATING
PLANE
1.00
REF
0.50
REF
0.355
0.330
0.304
0.020
REF
0.280
0.250
0.220
0.230
0.212
0.192
0.348
0.328
0.308
0.04 MAX
COPLANARITY
BALL A1
IDENTIFIER
Figure 45. 11-Ball, Backside-Coated, Wafer Level Chip Scale Package [WLCSP]
(CB-11-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
AD8235ACBZ-P7
1
−40°C to + 125°C 11-Ball [WLCSP] CB-11-1 H20
1
Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08211-0-8/09(0)