Datasheet

Data Sheet AD8224
Rev. C | Page 9 of 28
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter Rating
Supply Voltage ±18 V
Power Dissipation See Figure 2
Output Short-Circuit Current Indefinite
1
Input Voltage (Common Mode) ±V
S
Differential Input Voltage ±V
S
Storage Temperature Range −65°C to +130°C
Operating Temperature Range
2
−40°C to +125°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature 130°C
Package Glass Transition Temperature 130°C
ESD (Human Body Model) 4 kV
ESD (Charge Device Model) 1 kV
ESD (Machine Model) 0.4 kV
1
Assumes the load is referenced to midsupply.
2
Temperature for specified performance is −40°C to +85°C. For performance
to 125°C, see the Typical Performance Characteristics section.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 9.
Exposed Paddle Package θ
JA
Unit
CP-16-13: LFCSP, EPAD Soldered to Board 48 °C/W
CP-16-13: LFCSP, EPAD Not Soldered to Board 86 °C/W
Table 10.
Hidden Paddle Package θ
JA
Unit
CP-16-19: LFCSP 86 °C/W
The θ
JA
values in Table 9 and Table 10 assume a 4-layer JEDEC
standard board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θ
JC
at the exposed pad is
4.4°C/W.
Maximum Power Dissipation
The maximum safe power dissipation for the AD8224 is limited
by the associated rise in junction temperature (T
J
) on the die. At
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality. Figure 2
shows the maximum safe power dissipation in the package vs.
the ambient temperature for the LFCSP on a 4-layer JEDEC
standard board.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
–60 –40
–20 0 20 40 60 80
100
120 140
06286-002
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
θ
JA
= 48°C/W WHEN THERMAL PAD
IS SOLDERED TO BOARD
θ
JA
= 86°C/W WHEN THERMAL PAD
IS NOT SOLDERED TO BOARD
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION