Datasheet

AD8224
Rev. C | Page 26 of 28
OUTLINE DIMENSIONS
COMPLIANT
TO
JEDEC STANDARDS MO-220-VGGC
04-06-2012-A
1
0.65
BSC
0.25 MIN
PIN 1
INDICATOR
1.95 REF
0.50
0.40
0.30
T
OP VIEW
12° MAX
0.80 MAX
0.65 TY
P
SE
A
TING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
2.65
2.50 SQ
2.35
16
5
1
3
8
9
1
2
4
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
Figure 67. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-13)
Dimensions are shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-263-VBBC
04-06-2012-A
1
0.65
BSC
1.95 REF
0.75
0.60
0.50
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.35
0.30
0.25
0.05 MAX
0.02 NOM
0.20 REF
16
5
13
8
9
12
4
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
BOTTOM VIEW
Figure 68. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad, with Hidden Paddle
(CP-16-19)
Dimensions shown in millimeters