Datasheet

AD8222
Rev. A | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage ±18 V
Output Short-Circuit Current Duration Indefinite
Input Voltage (Common Mode) ±V
S
Differential Input Voltage ±V
S
Storage Temperature Range −65°C to +130°C
Operational Temperature Range −40°C to +125°C
Package Glass Transition Temperature (T
G
) 130°C
ESD
Human Body Model 1 kV
Charge Device Model 1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions may affect device reliability.
THERMAL RESISTANCE
Table 6.
Package θ
JA
Unit
CP-16-19: LFCSP Without Thermal Pad 86 °C/W
CP-16-13: LFCSP with Thermal Pad 48 °C/W
The θ
JA
values in Table 6 assume a 4-layer JEDEC standard
board. For the LFCSP with thermal pad, it is assumed that the
thermal pad is soldered to a landing on the PCB board, with the
landing thermally connected to a heat dissipating power plane.
θ
JC
at the exposed pad is 4.4°C/W.
Maximum Power Dissipation
The maximum safe power dissipation for the AD8222 is limited
by the associated rise in junction temperature (T
J
) on the die. At
approximately 130C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality.
ESD CAUTION