Datasheet

AD8222
Rev. A | Page 22 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.
1
0.65
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.95 BCS
0.50
0.40
0.30
0.25 MIN
3.75
BSC SQ
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDI
C
ATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.00
BSC SQ
2.65
2.50 SQ
2.35
16
5
13
8
9
12
4
EXPOSED
PA D
BOTTOM VIEW
031006-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-13)
Dimensions are shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-263-VBBC
062309-B
3.75
BCS SQ
4.00
BSC SQ
0.65
BSC
0.75
0.60
0.50
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.35
0.30
0.25
0.05 MAX
0.02 NOM
0.20 REF
BOTTOM VIEW
0.60 M
A
X
0.60 MAX
1.95 REF
SQ
1
16
5
8
9
12
13
4
Figure 55. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad, with Hidden Paddle
CP-16-19
Dimensions shown in millimeters