Datasheet

Data Sheet AD8218
Rev. B | Page 13 of 16
OUTLINE DIMENSIONS
081806-A
COPLANARITY
0.08
0.50
0.40
0.30
0.20 MIN
0.05 MAX
0.02 NOM
0.15 REF
0.50
PIN 1
INDICATOR
EXPOSED
PAD
BOT
TOM VIEW
TO
P VIEW
0.30
0.25
0.20
0.80
0.75
0.70
SE
A
TING
PLANE
3.00 BSC
SIDE VIEW
1
4
85
2.00 BSC
INDEX
AREA
1.90
1.80
1.65
1.75
1.65
1.50
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 37. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
2 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-4)
Dimensions shown in millimeters
CO
MPL
IANT
TO J
EDE
C ST
ANDA
RDS MO-187-AA
6°
0°
0
.80
0
.55
0.
40
4
8
1
5
0.6
5 BSC
0.
40
0.
25
1.1
0 MA
X
3.20
3
.00
2.8
0
C
OPL
ANARITY
0
.10
0.23
0.09
3.2
0
3
.00
2
.80
5
.15
4.9
0
4
.65
PI
N 1
IDEN
TIF
IER
15° MAX
0.
95
0.
85
0.7
5
0
.15
0.
05
1
0-07
-20
09-
B
Figure 38. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
AD8218BCPZ-RL −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-4 Y5A
AD8218BCPZ-WP −40°C to +125°C 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-8-4 Y5A
AD8218BRMZ −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 Y3K
AD8218BRMZ-RL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 Y3K
1
Z = RoHS Compliant Part.