Datasheet

Data Sheet AD8216
Rev. B | Page 5 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
5
6
7
8
0
7062-002
Figure 2. Metallization Diagram
–IN
1
GND
2
V
REF
2 3
NC 4
+IN
8
V
REF
1
7
V+ 6
OUT 5
NC = NO CONNECT
AD8216
TOP VIEW
(Not to Scale)
07062-003
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No. Mnemonic X Y
1 −IN −320 +390
2 GND −357 +14
3 V
REF
2 −349 −201
4 NC NC NC
5 OUT +348 −325
6 V+ +349 −194
7 V
REF
1 +349 −26
8 +IN +318 +390
Die size is 1100 μm by 1035 μm.
Die thickness is 13 mil.
Minimum passivation opening (minimum bond pad size)
is 92 μm × 92 μm.
Passivation type is 8 kA USG (Oxide) + 10 kA Oxynitride.
Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu.
Backside potential is V+.