Datasheet

AD820
REV. A
–16–
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Mini-DIP (N) Package
0.011±0.003
(0.28±0.08)
0.30 (7.62)
REF
15 °
0 °
PIN 1
4
58
1
0.25
(6.35)
0.31
(7.87)
0.10
(2.54)
BSC
SEATING
PLANE
0.035±0.01
(0.89±0.25)
0.18±0.03
(4.57±0.76)
0.033
(0.84)
NOM
0.018±0.003
(0.46±0.08)
0.125
(3.18)
MIN
0.165±0.01
(4.19±0.25)
0.39 (9.91) MAX
SOIC (R) Package
0.019 (0.48)
0.014 (0.36)
0.050
(1.27)
BSC
0.102 (2.59)
0.094 (2.39)
0.197 (5.01)
0.189 (4.80)
0.010 (0.25)
0.004 (0.10)
0.098 (0.2482)
0.075 (0.1905)
0.190 (4.82)
0.170 (4.32)
0.030 (0.76)
0.018 (0.46)
10 °
0 °
0.090
(2.29)
8 °
0 °
0.020 (0.051) x 45 °
CHAMF
1
8
5
4
PIN 1
0.157 (3.99)
0.150 (3.81)
0.244 (6.20)
0.228 (5.79)
0.150 (3.81)
C1792a–10–3/94
PRINTED IN U.S.A.