Datasheet

AD8206 Data Sheet
Rev. B | Page 6 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
04953-002
Figure 2. Metallization Diagram
NC = NO CONNECT
AD8206
TOP VIEW
(Not to Scale)
–IN
1
GND
2
V
REF
2
3
NC
4
+IN
V
REF
1
V+
OUT
8
7
6
5
04953-003
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
X
Y
1 −IN −209 +486
2 GND −447 +34
3 V
REF
2 −432 −480
4 NC N/A N/A
5 OUT +444 −495
6 V+ +444 −227
7 V
REF
1 +456 +342
8
+IN
+207
+486
Die size is 1245 µm by 1400 µm.
Die thickness is 13 mil.
Minimum passivation opening (minimum bond pad size)
is 92 µm × 92 µm.
Passivation type is 8KA USG (Oxide) + 10KA Oxynitride.
Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu.
Backside potential is V+.