Datasheet

Data Sheet AD8205
Rev. | Page 5 of 12
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
04315-0-002
Figure 2. Metallization Diagram
NC = NO CONNECT
AD8205
TOP VIEW
(Not to Scale)
–
IN
1
GND
2
V
REF
2
3
NC
4
+IN
V
REF
1
V+
OUT
8
7
6
5
04315-0-026
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
X
Y
1 −IN −206 508
2 GND −447 57
3 V
REF
2 −432 −457
4 NC N/A N/A
5 OUT 444 −472
6 V+ 444 −203
7 V
REF
1 456 434
8
+IN
203
509
Die size is 1170 µm by 1280 µm.
Die thickness is 13 mil.
Minimum passivation opening (minimum bond pad size) is
92 µm × 92 µm.
Passivation type is 8KA USG (Oxide) + 10KA Oxynitride.
Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu.
Backside potential is V+.
D