Datasheet

Data Sheet AD8195
Rev. B | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
AVCC to AVEE 3.7 V
VTTI
AVCC + 0.6 V
VTTO AVCC + 0.6 V
AMUXVCC 5.5 V
VREF_IN 5.5 V
VREF_OUT 5.5 V
Internal Power Dissipation 1.81 W
High Speed Input Voltage
AVCC − 1.4 V < V
IN
<
AVCC + 0.6 V
High Speed Differential Input Voltage 2.0 V
Parallel Control Input Voltage
AVEE − 0.3 V < V
IN
<
AVCC + 0.6 V
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Junction Temperature 150°C
ESD, Human Body Model
Input Pins Only ±5 kV
All Other Pins ±3 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 5.
Package θ
JA
θ
JC
Unit
40-Lead LFCSP_VQ 36 5.0 °C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8195
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a junction
temperature of 175°C for an extended period can result in device
failure. To ensure proper operation, it is necessary to observe
the maximum power derating as determined by the thermal
resistance coefficients.
ESD CAUTION