Datasheet

Data Sheet AD8195
Rev. B | Page 19 of 20
OUTLINE DIMENSIONS
1
40
10
11
31
30
21
20
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
06-01-2012-D
0.50
BSC
PIN 1
INDICATOR
4.50 REF
0.20 MIN
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.25
4.10 SQ
3.95
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
6.10
6.00 SQ
5.90
5.85
5.75 SQ
5.65
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
(BOTTOM VIEW)
Figure 36. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description
Package
Option
Ordering
Quantity
AD8195ACPZ −40°C to +85°C 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-40-1
AD8195ACPZ-R7 −40°C to +85°C 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7” Tape and Reel CP-40-1 750
AD8195-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.