Datasheet

AD8192
Rev. 0 | Page 5 of 28
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
AVCC to AVEE 3.7 V
DVCC to DVEE 3.7 V
DVEE to AVEE ±0.3 V
VTTI AVCC + 0.6 V
VTTO AVCC + 0.6 V
AMUXVCC 5.5 V
VREF_AB 5.5 V
VREF_COM 5.5 V
Internal Power Dissipation 2.41 W
High Speed Input Voltage AVCC − 1.4 V < V
IN
< AVCC + 0.6 V
High Speed Differential
Input Voltage
2.0 V
Low Speed Input Voltage DVEE − 0.3 V < V
IN
< AMUXVCC + 0.6 V
I
2
C Logic Input Voltage DVEE − 0.3 V < V
IN
< DVCC + 0.6 V
Storage Temperature
Range
−65°C to +125°C
Operating Temperature
Range
−40°C to +85°C
Junction Temperature 150°C
ESD HBM Input Pins Only ±7 kV
ESD HBM All Other Pins ±1.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a four-layer JEDEC circuit board for surface-mount
packages. θ
JC
is specified for the exposed pad soldered to the
circuit board with no airflow.
Table 5. Thermal Resistance
Model θ
JA
θ
JC
Unit
56-Lead LFCSP 27 2.1 °C/W
ESD CAUTION