Datasheet

AD8192
Rev. 0 | Page 25 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2
033108-A
PIN 1
INDICATOR
TOP
VIEW
7.75
BSC SQ
8.00
BSC SQ
1
56
14
15
43
42
28
29
4.95
4.80 SQ
4.65
0.50
0.40
0.30
0.30
0.23
0.18
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
6.50
REF
SEATING
PLANE
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
COPLANARITY
0.08
0.05 MAX
0.02 NOM
0.30 MIN
*
EXPOSED
PAD
(BOTTOM VIEW)
*
NOTE:
THE AD8192 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL HDMI/DVI TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO AVEE. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO AN AVEE PLANE REDUCES THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
Figure 35. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
8 mm × 8 mm Body, Very Thin Quad
(CP-56-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description
Package
Option Ordering Quantity
AD8192ACPZ
1
−40°C to +85°C 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-56-3
AD8192ACPZ-RL7
1
−40°C to +85°C 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Reel 7 CP-56-3 750
AD8192-EVALZ
1
Evaluation Board
1
Z = RoHS Compliant Part.