Datasheet

AD8158
Rev. B | Page 36 of 36
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VRRE.
061108-B
11.75
BSC SQ
12.00
BSC SQ
1
25
75
51
26
50
100
76
0.50
0.40
0.30
0.70
0.65
0.60
0.25
0.20
0.15
9.60 REF
7.00
6.90 SQ
6.80
PIN 1
INDICATOR
0.20 MIN
0.40
BSC
0.20 REF
0.90
0.85
0.80
0.05 MAX
0.01 NOM
EXPOSEDPAD
(BOTTOM VIEW)
PIN 1
INDICATOR
SEATING
PLANE
12° MAX
0.60 MAX
0.60 MAX
TOP VIEW
THE EXPOSED METAL PADDLE ON THE
BOTTOM OF THE LFCSP PACKAGE
MUST BE SOLDERED TO PCB GROUND
FOR PROPER HEAT DISSIPATION AND
ALSO FOR NOISE AND MECHANICAL
STRENGTH BENEFITS.
Figure 52. 100-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
12 mm × 12 mm Body, Very Thin Quad
(CP-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8158ACPZ −40°C to +85°C 100-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-100-1
AD8158-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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registered trademarks are the property of their respective owners.
D06646-0-12/09(B)