Datasheet

AD8143
Rev. 0 | Page 24 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.45
3.30 SQ
3.15
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
Figure 49. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD8143ACPZ-R2
1
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-3
AD8143ACPZ-REEL
1
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-3
AD8143ACPZ-REEL7
1
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-3
1
Z = Pb-free part.
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D05538–0–10/05(0)