Datasheet

AD8134
Rev. A | Page 18 of 20
LAYOUT AND POWER SUPPLY DECOUPLING
CONSIDERATIONS
Standard high speed PCB layout practices should be adhered to
when designing with the AD8134. A solid ground plane is
recommended and good wideband power supply decoupling
networks should be placed as close as possible to the supply
pins. Small surface-mount ceramic capacitors are recommended
for these networks, and tantalum capacitors are recommended
for bulk supply decoupling.
AMPLIFIER-TO-AMPLIFIER ISOLATION
The least amount of isolation between the three amplifiers
exists between Amplifier R and Amplifier G. This is therefore
viewed as the worst-case isolation and is what is reflected in the
Specifications tables and Typical Performance Characteristics.
Refer to the basic test circuit in
Figure 5 for test conditions.
EXPOSED PADDLE (EP)
The 24-lead LFCSP package has an exposed paddle on the
underside of its body. To achieve the specified thermal resistance,
it must have a good thermal connection to one of the PCB planes.
The exposed paddle must be soldered to a pad on top of the
board that is connected to an inner plane with several thermal
vias.