Datasheet

AD8133
Rev. 0 | Page 16 of 16
OUTLINE DIMENSIONS
1
24
6
7
13
19
18
BOTTOM
VIEW
12
2.25
2.10 SQ
1.95
0.60 MAX
0.50
0.40
0.30
0.30
0.23
0.18
2.50 REF
0.50
BSC
12° MAX
0.80 MAX
0.65TYP
0.05 MAX
0.02 NOM
1.00
0.85
0.80
SEATING
PLANE
PIN 1
INDICATOR
TOP
VIEW
3.75
BSC SQ
4.00
BSC SQ
PIN 1
INDICATOR
0.60 MAX
COPLANARITY
0.08
0.20 REF
0.25 MIN
COMPLIANTTO JEDECSTANDARDS MO-220-VGGD-2
Figure 37. 24-Lead Lead Frame Chip Scale Package [LFCSP],
4 mm× 4 mm (CP-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Package Package Description Package Outline
AD8133ACP-REEL −40°C to +85°C 24-Lead LFCSP CP-24
AD8133ACP-REEL7 −40°C to +85°C 24-Lead LFCSP CP-24
AD8133ACPZ-REEL
1
−40°C to +85°C 24-Lead LFCSP CP-24
AD8133ACPZ-REEL7
1
−40°C to +85°C 24-Lead LFCSP CP-24
1
Z = Pb-free part.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and regis-
tered trademarks are the property of their respective owners.
D04769–0–7/04(0)