Datasheet
AD8117/AD8118
Rev. A | Page 36 of 36
OUTLINE DIMENSIONS
*
COMPLIANT TO JEDEC STANDARDS MO-192-BAN-2
WITH THE EXCEPTION TO PACKAGE HEIGHT.
DETAIL A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
1
35
7
9111517192123 13
4
6
8
1012
2
16182022 14
27.94
BSC SQ
BOTTOM
VIEW
A
1 CORNER
INDEX AREA
1.27
BSC
TOP VIEW
31.00
BSC SQ
BALL A1
INDICATOR
0.10 MIN
0.70
0.63
0.56
1.07
0.99
0.92
COPLANARITY
0.20
0.90
0.75
0.60
SEATING
PLANE
BALL DIAMETER
DETAIL A
*
1.765 MAX
022206-A
0.25 MIN
(4 )
Figure 74. 304-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
(BP-304)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature
Range
Package Description Package Option
AD8117ABPZ
1
−40°C to +85°C 304-Ball Ball Grid Array Package, Thermally Enhanced [BGA_ED] BP-304
AD8118ABPZ
1
−40°C to +85°C 304-Ball Ball Grid Array Package, Thermally Enhanced [BGA_ED] BP-304
AD8117-EVAL Evaluation Board
AD8118-EVAL Evaluation Board
1
Z = RoHS Compliant Part.
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06365-0-5/07(A)