Datasheet

AD810
REV. A
–16–
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Plastic Mini-DIP (N) Package
0.011 ±0.003
(0.28 ±0.08)
0.30 (7.62)
REF
15 °
0 °
PIN 1
4
5
8
1
0.25
(6.35)
0.31
(7.87)
0.10
(2.54)
BSC
SEATING
PLANE
0.035 ±0.01
(0.89 ±0.25)
0.18 ±0.03
(4.57 ±0.76)
0.033
(0.84)
NOM
0.018
±0.003
(0.46 ±0.08)
0.125
(3.18)
MIN
0.165 ±0.01
(4.19 ±0.25)
0.39 (9.91) MAX
Cerdip (Q) Package
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
15 °
0 °
0.005 (0.13) MIN
0.055 (1.40) MAX
1
PIN 1
4
5
8
0.310 (7.87)
0.220 (5.59)
0.405 (10.29) MAX
0.200
(5.08)
MAX
SEATING
PLANE
0.023 (0.58)
0.014 (0.36)
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
0.150
(3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.100
(2.54)
BSC
8-Pin SOIC (R) Package
0.019 (0.48)
0.014 (0.36)
0.050
(1.27)
BSC
0.102 (2.59)
0.094 (2.39)
0.197 (5.01)
0.189 (4.80)
0.010 (0.25)
0.004 (0.10)
0.098 (0.2482)
0.075 (0.1905)
0.190 (4.82)
0.170 (4.32)
0.030 (0.76)
0.018 (0.46)
10 °
0 °
0.090
(2.29)
8 °
0 °
0.020 (0.051) x 45 °
CHAMF
1
8
5
4
PIN 1
0.157 (3.99)
0.150 (3.81)
0.244 (6.20)
0.228 (5.79)
0.150 (3.81)
All brand or product names mentioned are trademarks or registered trademarks of their respective holders.
C1737–24–10/92
PRINTED IN U.S.A.