Datasheet

AD8106/AD8107
Rev. 0 | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
Table 4.
MAXIMUM POWER DISSIPATION
Parameter Rating
The maximum power that can be safely dissipated by the
AD8106/AD8107 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit can cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package.
Supply Voltage 12.0 V
Internal Power Dissipation
AD8106/AD8107 80-Lead LQFP (ST-80-1) 2.6 W
Input Voltage ±V
S
Output Short-Circuit Duration
Observe power
derating curves
θ
JA
48°C/W
Operating Temperature Range −40°C to 85°C
Storage Temperature Range −65°C to +125°C
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
Lead Temperature (Soldering 10 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
While the AD8106/AD8107 is internally short-circuit
protected, this may not be sufficient to guarantee that the
maximum junction temperature (150°C) is not exceeded under
all conditions. To ensure proper operation, it is necessary to
observe the maximum power derating curves shown in
Figure 3.
AMBIENT TEMPERATURE (°C)
5
MAXIMUM POWER DISSIP
A
TION (W)
4
0
–50 80–40 –30 –20 –10 0 10 20 30 40 50 60 70
3
2
1
90
T
J
= 150°C
05774-003
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.