Datasheet
AD8104/AD8105   
Rev. 0 | Page 36 of 36 
OUTLINE DIMENSIONS 
*
COMPLIANT TO JEDEC STANDARDS MO-192-BAN-2
 WITH THE EXCEPTION TO PACKAGE HEIGHT.
DETAIL A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
1
35
7
9111517192123 13
4
6
8
1012
2
16182022 14
27.94
BSC SQ
BOTTOM
VIEW
A
1 CORNER
INDEX AREA
1.27
BSC
TOP VIEW
31.00
BSC SQ
BALL A1
INDICATOR
0.10 MIN
0.70
0.63
0.56
1.07
0.99
0.92
COPLANARITY
0.20
0.90
0.75
0.60
SEATING
PLANE
BALL DIAMETER
DETAIL A
*
1.765 MAX
022206-A
0.25 MIN
(4 )
Figure 74. 304-Ball Ball Grid Array, Thermally Enhanced [BGA_ED] 
(BP-304) 
Dimensions shown in millimeters 
ORDERING GUIDE 
Model  Temperature Range  Package Description  Package Option 
AD8104ABPZ
1
−40°C to +85°C  304-Ball Ball Grid Array Package, Thermally Enhanced [BGA_ED]  BP-304 
AD8105ABPZ
1
−40°C to +85°C  304-Ball Ball Grid Array Package, Thermally Enhanced [BGA_ED]  BP-304 
AD8104-EVAL  Evaluation Board   
AD8105-EVAL  Evaluation Board   
1
 Z = RoHS Compliant Part. 
©2007 Analog Devices, Inc. All rights reserved. Trademarks and  
 registered trademarks are the property of their respective owners. 
  D06612-0-6/07(0) 










