Datasheet

AD8099
Data Sheet
Rev. D | Page 24 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-012-AA
06-02-2011-B
1.27
0.40
1.75
1.35
2.29
2.29
0.356
0.457
4.00
3.90
3.80
6.20
6.00
5.80
5.00
4.90
4.80
0.10 MAX
0.05 NOM
3.81 REF
0.25
0.17
8°
0°
0.50
0.25
45°
COPLANARITY
0.10
1.04 REF
8
1
4
5
1.27 BSC
S
EATING
PLANE
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE CONNECTION DIAGRAMS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
TOP VIEW
0.51
0.31
1.65
1.25
Figure 72. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]
Narrow Body
(RD-8-1)
Dimensions shown in millimeters
1
EXPOSED
PA D
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
04-04-2012-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE CONNECTION DIAGRAMS
SECTION OF THIS DATA SHEET.
Figure 73. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters